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1. general description the device is intended for switching between two rgb or yuv video sources. the outputs can be set to a high-impedance state to enable parallel connection of several devices. a high level on sel (pin 5) selects the video inputs of channel 2. the iocntr control pin (pin 16) de?nes the 3-state outputs and clamp inputs: ? high = 3-state outputs (also for test; active clamp) ? low = passive clamp at the video inputs (diode) ? sandcastle: the video signal is clamped with an active clamp during the sync pulse. 2. features n yuv/rgb and fast blanking switch n 3-state output n selectable clamp: u passive (with diodes) or u active clamp. n bandwidth greater than 22 mhz n fully esd protected n latch-up free. 3. applications n standard and high de?nition television sets n peri-television sets. 4. quick reference data tda8601 rgb/yuv and fast blanking switch rev. 03 23 september 2004 product data sheet table 1: quick reference data symbol parameter conditions min typ max unit v p supply voltage 7.2 8.0 8.8 v g v voltage gain - 0.5 0 +0.5 db b bandwidth at 3 db 22 - - mhz a ct crosstalk attenuation between two video channels f i = 5 mhz - 60 - - db t amb operating ambient temperature 0 - 70 c
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 2 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 5. ordering information 6. block diagram table 2: ordering information type number package name description version tda8601/c2 dip16 plastic dual in-line package; 16 leads (300 mil); long body sot38-1 tda8601t/c2 so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 fig 1. block diagram. 001aab574 8 5 91 15 14 3-state tda8601 selectable clamp 4 10 3-state 13 selectable clamp 7 3-state selectable clamp 3 11 selectable clamp 6 3-state selectable clamp 2 12 16 selectable clamp decoding v p iocntr vidia1 fbi1 vidib1 fbi2 vidic1 fbo sel vidoa vidia2 vidob vidib2 vidoc vidic2 gnd
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 3 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 7. pinning information 7.1 pinning 7.2 pin description fig 2. pin con?guration sot38-1 (dip16). fig 3. pin con?guration sot109-1 (so16). tda8601 v p iocntr vidia1 fbi1 vidib1 fbi2 vidic1 fbo sel vidoa vidia2 vidob vidib2 vidoc vidic2 gnd 001aab744 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 tda8601 v p iocntr vidia1 fbi1 vidib1 fbi2 vidic1 fbo sel vidoa vidia2 vidob vidib2 vidoc vidic2 gnd 001aab575 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 table 3: pin description symbol pin description v p 1 supply voltage (8 v) vidia1 2 video input a (channel 1) vidib1 3 video input b (channel 1) vidic1 4 video input c (channel 1) sel 5 channel selection vidia2 6 video input a (channel 2) vidib2 7 video input b (channel 2) vidic2 8 video input c (channel 2) gnd 9 ground vidoc 10 video output c vidob 11 video output b vidoa 12 video output a fbo 13 fast blanking output signal fbi2 14 fast blanking input signal (channel 2) fbi1 15 fast blanking input signal (channel 1) iocntr 16 control of video input or video output
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 4 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 8. internal circuitry table 4: internal circuitry internal pin con?guration 001aab580 tda8601 2 15 16 7 14 4 6 5 1 3 8 7 13 12 10 9 11 v p iocntr vidia1 fbi1 vidib1 fbi2 vidic1 fbo sel vidoa vidia2 vidob vidib2 vidoc vidic2 gnd
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 5 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 9. limiting values 10. thermal characteristics 11. characteristics 11.1 operating characteristics table 5: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v p supply voltage - 0.3 +9 v v i input voltage (pins 2 to 4 and 6 to 8) referenced to ground 0 8.8 v t j junction temperature - 150 c t stg ic storage temperature - 55 +150 c table 6: thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air dip16 70 k/w so16 115 k/w table 7: operating characteristics the operating characteristics are the conditions within the ic when it is functional; these conditions can have any value. for example, condition v il (pin 5) is ?xed at 0.5 v. the ic will then operate over the full temperature range and supply voltage range. symbol parameter conditions min typ max unit supply v p operating supply voltage 7.2 8.0 8.8 v video inputs (pins 1 to 3 and 6 to 8) v i(p-p) input video signal amplitude (peak-to-peak value) r, g, b signals - 0.7 1 v y signal; active clamp - 1 1.4 v - (b - y) signal; active clamp - 1.05 1.5 v - (r - y) signal; active clamp - 1.33 1.9 v c i input clamp capacitor - 47 - nf control inputs (pins 5 and 16) v ih high level input voltage (pin 5) i ih = 10 m a 1.2 - v p v v il low level input voltage (pin 5) i il = - 10 m a - - 0.5 v v ih high level input voltage (pin 16) i ih = 10 m a 2.0 - v p v v il low level input voltage (pin 16) i il = - 10 m a - - 0.8 v
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 6 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch [1] for the dip16 package, the thermal resistance is lower. the minimum value for the output load resistor is 270 w . 11.2 characteristics v sc sandcastle input voltage level (pin 16) zero level - - 1.1 v blanking level 2.0 - 3.1 v clamp level 3.9 - 5.5 v t w clamp pulse width secam mode - 3.6 - m s pal mode - 2.5 - m s fast blanking inputs (pins 14 and 15) v ih high level input voltage 1.2 - v p v v il low level input voltage - - 0.5 v video outputs (pins 10 to 12) c l output load capacitor - - 15 pf r l output load resistor [1] 1- - k w fast blanking output (pin 13) c l output load capacitor - 40 100 pf r l output load resistor [1] 1- - k w table 7: operating characteristics continued the operating characteristics are the conditions within the ic when it is functional; these conditions can have any value. for example, condition v il (pin 5) is ?xed at 0.5 v. the ic will then operate over the full temperature range and supply voltage range. symbol parameter conditions min typ max unit table 8: characteristics the typical values are given for v p = 8 v; t amb = 25 c. c l = 40 pf; no load resistor; measured in application circuit of figure 8 over full supply voltage and temperature range; unless otherwise speci?ed. symbol parameter conditions min typ max unit supply i p supply current no resistive load on the outputs - 3345ma svrr supply voltage rejection ratio f i = 40 hz to 50 khz [1] -- - 36 db f i = 40 hz [1] - - 51 - 36 db video inputs (pins 1 to 3 and 4 to 6) r i input resistance for each type of clamp 10 - - k w c i(max) maximum input capacitance -3-pf v clamp input clamping voltage level i i = - 50 m a; passive clamp 0.8 1.21 1.35 v i i = 50 m a; active clamp; v iocntr = 3.9 v 2.05 2.42 2.70 v i i = - 50 m a; active clamp; v iocntr = 3.9 v 2.05 2.37 2.70 v i sink input sink current v i = 2 v; passive clamp 0.3 1.6 3 m a
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 7 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch |l clamp | maximum absolute input clamping current v i = v clamp + 0.5 v; active clamp 200 - - m a video outputs (pins 10 to 12) r o output resistance - - 50 w r oz output resistance 3-state output 0.1 - - m w c oz(max) maximum output capacitance 3-state output - 3 - pf g v voltage gain f i = 1 mhz - 0.5 0 +0.5 db b bandwidth at 0.5 db 5 - - mhz at 1 db 10 - - mhz at 3 db 22 40 - mhz a ct crosstalk attenuation between two video channels f i = 5 mhz [2] - 60--db f i = 10 mhz [2] - 50--db f i = 22 mhz [2] - 40--db a off isolation of the 3-state con?guration f i = 5 mhz [2] - 60--db f i = 10 mhz [2] - 50--db f i = 22 mhz [2] - 40--db sr slew rate 100 120 - v/ m s | d g m | gain matching between two different signals of the same channel f i = 5 mhz - - 0.5 db v o(bl) output blanking level voltage 2.1 2.23 2.7 v v os(bl) output blanking offset voltage v i(ch1) = 0.7 v (p-p) (white); v i(ch2) = 0 v (p-p) (black); active clamp [3] --10mv v i(ch1) = 0.7 v (p-p) (white); v i(ch2) = 0 v (p-p) (black); passive clamp [3] --15mv d v os(bl) matching of output blanking offset voltage v i(ch1) = 0.7 v (p-p) (white); v i(ch2) = 0 v (p-p) (black); active clamp [3] --10mv v i(ch1) = 0.7 v (p-p) (white); v i(ch2) = 0 v (p-p) (black); passive clamp [3] --10mv fast blanking inputs (pins 14 and 15) z i input impedance 10 - - k w fast blanking output (pin 13) v oh high level output voltage 2 2.35 3 v v ol low level output voltage 0 0.15 0.3 v table 8: characteristics continued the typical values are given for v p = 8 v; t amb = 25 c. c l = 40 pf; no load resistor; measured in application circuit of figure 8 over full supply voltage and temperature range; unless otherwise speci?ed. symbol parameter conditions min typ max unit
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 8 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch [1] the supply voltage rejection ratio is measured at the video outputs (pins 10 to 12) when a sine wave is applied on the power supply pin (pin 1); where: v dc = 8 v; v i = 100 mv (p-p). this additional sine wave on the power supply pin is guaranteed not to cause extraneous oscillations on the video control and fast blanking signals. [2] the 6 video inputs will contain the same signal. the source impedance is 50 w . [3] the blanking offset is the level difference between the two channels when they are selected separately and, also, on one video output. this value is measured on each video signal. [4] the delay between the sel input and the video output together with the switching time of the video output is illustrated in figure 4 . the amplitude of the video signal is 1.9 v (p-p) when the clamp is active and 1.0 v (p-p) when the clamp is passive. [5] the delay between the sel input and fast blanking output together with the switching time of fast blanking output is illustrated in figure 5 . [6] the fast blanking delay between input and output is illustrated in figure 6 . [7] the video delay between input and output and delay differences are illustrated in figure 7 . inputs 1 and 2 are either fast blanking input plus a video signal or two video signals. the amplitude of the video signal is 0.5 v (p-p). the video signal levels (i1, i2, o1 and o2) are 50% of the video amplitude. the fast blanking signal levels (i1 and o1) are 1.2 v when the signal rises and 0.5 v when the signal falls. z o output impedance - - 50 w sel input (pin 5) z i input impedance 10 - - k w timing t dsel;vid delay time between sel input and video output [4] - 1220ns t dsel;fbo delay time between sel input and fast blanking output [5] - 1540ns t swvid switching time of video output [4] - 8.5 15 ns t swfbo switching time of fast blanking output [5] - 8.5 15 ns t dfb fast blanking level delay between input and output [6] - 1320ns t dvid video delay between input and output [7] - 4 20 ns d t dvid delay difference between two video signals at the output [7] - 0.5 10 ns d t dfb;vid delay difference between fast blanking level and video at the output [7] - 5 10 ns table 8: characteristics continued the typical values are given for v p = 8 v; t amb = 25 c. c l = 40 pf; no load resistor; measured in application circuit of figure 8 over full supply voltage and temperature range; unless otherwise speci?ed. symbol parameter conditions min typ max unit
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 9 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch fig 4. timing de?nition: sel and vido. fig 5. timing de?nition: sel and fbo. t swvid t swvid high level 0.5 v 1.2 v sel input t dsel;vid t dsel;vid low level picture 2 (white) 90 % 50 % 10 % 50 % picture 1 (black) video output (vido) 001aab576 1.9 v or 1.0 v high level 0.5 v 1.2 v sel input low level picture 2 (high level) 2.0 v 1.1 v 0.3 v 1.1 v picture 1 (low level) fast blanking output (fbo) 001aab577 t swfbo t swfbo t dsel;fbo t dsel;fbo
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 10 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch fig 6. timing de?nition: fast blanking delay. fig 7. timing de?nition: video delay. high level 0.5 v 1.2 v t dfb low level high level 2.0 v 0.3 v fast blanking output (fbo) 001aab578 low level fast blanking input (fbi) t dfb 001aab579 output 2 output 1 input 2 input 1 d t dvid t dvid level o2 level o1 level i2 level i1
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 11 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 12. application information fig 8. application diagram. 001aab581 10 m w 7 pf 10 m w 7 pf 10 m w 7 pf 10 m w 7 pf 2 outputs 3 4 15 5 tda8601 channel 1 47 nf r 47 nf g 47 nf b fbi1 channel 2 47 nf r 47 nf g 47 nf b fbi2 6 7 8 14 + 8 v 12 11 10 13 16 sandcastle clamp blanking zero probe 1 9 sel
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 12 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch fig 9. schematic diagram of two tda8601s operating four channels. 001aab582 2 select ic2 3 4 15 5 tda8601 ic2 channel 3 47 nf r 47 nf g 47 nf b fbi1 channel 4 47 nf r 47 nf g 47 nf b fbi2 6 7 8 14 + 8 v 12 11 10 13 16 1 9 channel select 001aab582 2 select ic1 3 4 15 5 tda8601 ic1 channel 1 47 nf r 47 nf g 47 nf b fbi1 channel 2 47 nf r 47 nf g 47 nf b fbi2 6 7 8 14 12 11 10 13 16 1 9
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 13 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 13. package outline fig 10. package outline sot38-1 (dip16). unit a max. 1 2 b 1 cee m h l references outline version european projection issue date iec jedec jeita mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot38-1 99-12-27 03-02-13 a min. a max. b max. w m e e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.3 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.1 0.02 0.19 050g09 mo-001 sc-503-16 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 16 1 9 8 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. (1) (1) d (1) z dip16: plastic dual in-line package; 16 leads (300 mil); long body sot38-1
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 14 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch fig 11. package outline sot109-1 (so16). x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 15 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 14. handling information inputs and outputs are protected against electrostatic discharge in normal handling. however, to be completely safe, it is desirable to take normal precautions appropriate to handling integrated circuits. 15. soldering 15.1 introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. 15.2 through-hole mount packages 15.2.1 soldering by dipping or by solder wave typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speci?ed maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 15.2.2 manual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 c and 400 c, contact may be up to 5 seconds. 15.3 surface mount packages 15.3.1 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 16 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 cto270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 15.3.2 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications.
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 17 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 15.3.3 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c. 15.4 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vapori zation of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [4] hot bar soldering or manual soldering is suitable for pmfp packages. [5] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. [6] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot pene trate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposite d on the heatsink surface. [7] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [8] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [9] wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [10] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil . however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropri ate soldering pro?le can be provided on request. table 9: suitability of ic packages for wave, re?ow and dipping soldering methods mounting package [1] soldering method wave re?ow [2] dipping through-hole mount cpga, hcpga suitable -- dbs, dip, hdip, rdbs, sdip, sil suitable [3] - suitable through-hole-surface mount pmfp [4] not suitable not suitable - surface mount bga, htsson..t [5] , lbga, lfbga, sqfp, ssop..t [5] , tfbga, vfbga, xson not suitable suitable - dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [6] suitable - plcc [7] , so, soj suitable suitable - lqfp, qfp, tqfp not recommended [7] [8] suitable - ssop, tssop, vso, vssop not recommended [9] suitable - cwqccn..l [10] , wqccn..l [10] not suitable not suitable -
9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 18 of 20 philips semiconductors tda8601 rgb/yuv and fast blanking switch 16. revision history table 10: revision history document id release date data sheet status change notice doc. number supersedes tda8601_3 20040923 product data sheet - 9397 750 13713 tda8601_2 modi?cations: ? the format of this data sheet has been redesigned to comply with the new presentation and information standard of philips semiconductors ? section 5 : ordering information adapted to present tda8601/c2 and tda8601t/c2 types ? section 7 : pin con?guration drawings updated to current standard ? section 9 : changed v p maximum value to +9 v ? section 11 : various values are updated to match tda8601/c2 and tda8601t/c2 ? figure 4 , 5 and 6 : measurement level changed to 1.2 v tda8601_2 19960627 product speci?cation - 9397 750 00932 tda8601_1 tda8601_1 19940731 product speci?cation - 9397 736 40011 -
philips semiconductors tda8601 rgb/yuv and fast blanking switch 9397 750 13713 ? koninklijke philips electronics n.v. 2004. all rights reserved. product data sheet rev. 03 23 september 2004 19 of 20 17. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 18. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 19. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 20. licenses 21. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). purchase of philips i 2 c-bus components purchase of philips i 2 c-bus components conveys a license under the philips i 2 c-bus patent to use the components in the i 2 c-bus system provided the system conforms to the i 2 c-bus speci?cation de?ned by koninklijke philips electronics n.v. this speci?cation can be ordered using the code 9398 393 40011.
? koninklijke philips electronics n.v. 2004 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 23 september 2004 document number: 9397 750 13713 published in the netherlands philips semiconductors tda8601 rgb/yuv and fast blanking switch 22. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 1 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 thermal characteristics. . . . . . . . . . . . . . . . . . . 5 11 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11.1 operating characteristics . . . . . . . . . . . . . . . . . 5 11.2 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 application information. . . . . . . . . . . . . . . . . . 11 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 14 handling information. . . . . . . . . . . . . . . . . . . . 15 15 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.2 through-hole mount packages . . . . . . . . . . . . 15 15.2.1 soldering by dipping or by solder wave . . . . . 15 15.2.2 manual soldering . . . . . . . . . . . . . . . . . . . . . . 15 15.3 surface mount packages . . . . . . . . . . . . . . . . 15 15.3.1 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 15 15.3.2 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 15.3.3 manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 15.4 package related soldering information . . . . . . 17 16 revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 17 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19 18 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 19 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 20 licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 21 contact information . . . . . . . . . . . . . . . . . . . . 19

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